The B1 is a dual - mode Bluetooth module that enables the retransmission of discarded packets to enhance voice quality. It is designed for embedded applications and employs an advanced 40 - nmcmos low - power manufacturing process with a high level of integration. For Bluetooth SIG - standard interfaces involving voice, data, home automation, accessories, and other applications, the B1 is the optimal solution.
Performance Parameters
Main Chip: CYW20706UA2KFB4G, ARM Cortex - M3
Supported Frequencies: 2402 - 2480MHz
Output Power: - 96.5dBm
Bluetooth Version: 9dBm
Specifications:
Dimensions**: BT2.1 + EDR/3.0/4.2LE
Pin Pitch/Number: 21 x 12.2 x 2.9mm
Packaging/Weight: 1.1mm/32pin
Interfaces:
Audio Interface : LCC/5g
Serial Port: Through I2S
SPI: 1 - way
I2S: 1 - way
Antenna: 1 - way
Electrical Characteristics:
Operating Voltage: Built - in
Operating Current: DC3.0 - 3.6V, Typ: 3.3V
Power Consumption: ≤60mA
Standby Current: ≤23uA
Shutdown Current: 0.2uA
Environmental Parameters:
Operating Temperature: - 30°C - 85°C
Storage Temperature: - 40°C - 150°C
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